ICEEET 2026 Organizers Signed MoU with IEEE Sri Lanka Section for Proceedings Publication in IEEE Xplore
The 2026 IEEE International Electrical Engineering Conference (ICEEET 2026) has signed a Memorandum of Understanding (MoU) with the IEEE Sri Lanka Section for the publication process of the conference proceedings in IEEE Xplore, subject to compliance with IEEE conference publication requirements.
The conference organizers sincerely acknowledge the support and cooperation of the IEEE Sri Lanka Section in facilitating the proceedings publication process for IEEE Xplore.

Conference Publication Approval from IEEE SriLanka Chapter
The first stage of document review has been completed successfully, and the conference is proceeding to the second review phase as part of the IEEE approval process. (Formal agreement is subject to final approval.)